Welcome to SHENZHEN TOPREACH SCI-TECH CO.,LTD!
Item Capability
 Material Brand  Shengyi,TUC,EMC,ITEQ,Boyu,NanYA,KB
 Layer Count  1- 28 layers;  HDI  2+N+2
 Laminate Material  FR-4,High TG,High CTI,High Frequency,Aluminum Base , Copper Base
 Finished Board Thickness  0.4 - 4.0mm (16 - 158 mil) 
 Max. Panel Size  520×1200mm 
 Outline Tolerance  ± 0.10mm
 Min. Line Width/Spacing   2.5mil (0.064mm)/2.5mil (0.064mm)
 Impedance Control   +/- 8% ohm
 Min. BGA PAD Size  8mil
 Min. Spacing between BGA PAD and Track  3.0mil
 Min. Spacing between Hole and Innerlayer Track  6mil 
 Hole Copper Thickness    Automotive PCB: Min.25um; Others:Avg.25um  Min.20um(IPC-III)
 Surface Copper Thickness  18um,35um,70um,105um,140um,175um (0.5oz – 5oz) 
 Min. Drilling Hole   Mechanical Drilling: 0.15mm (6mil); Laser Drilling: 0.1mm(4mil)
 Max. Aspect Ratio  12:1(Hole>0.30mm); 10:1(Hole≤0.30mm)
 Soldermask Color  Green, Blue, Black, White, Yellow, Red, etc.
 Min. Soldermask Dam  0.076mm(3mil)
 Surface Finish  Immersion Gold,OSP,HASL,LF HASL,Immersion Silver,Immersion Tin,Gold  Plating